ligitek electronics co.,ltd. property of ligitek only la16b/y-s1 data sheet led array doc. no : qw0905-la16b/y-s1 rev : a date : 12 - jul - 2005
page 1/4 2.0 ? 0.5 6.5 package dimensions 7.4 5.08 r 3.5 4.6 2.54typ - + ?? 0.5 typ ly2640-1 3.1 2.9 5.0 ? 0.5 4.75 ? 0.5 1.5max 0.5 typ 2.54typ 25.0min 1.0min 4.3 3.3 note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. part no. la16b/y-s1 ligitek electronics co.,ltd. property of ligitek only
unit ma ma y 20 80 ratings part no. la16b/y-s1 i f parameter peak forward current duty 1/10@10khz forward current symbol i fp absolute maximum ratings at ta=25 j mw g a j j 60 10 -40 ~ +85 -40 ~ +100 max 260 j for 5 sec max (2mm from body) ir operating temperature storage temperature reverse current @5v power dissipation soldering temperature tsol t opr tstg pd 50 12 8.0 2.6 max. min. typ. 35 585 min. 1.7 forward voltage @20ma(v) peak wave length f pnm spectral halfwidth ??f nm viewing angle 2 c 1/2 (deg) luminous intensity @10ma(mcd) gaasp/gap emitted yellow la16b/y-s1 part no material typical electrical & optical characteristics (ta=25 j ) color lens yellow diffused note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. ligitek electronics co.,ltd. property of ligitek only page 2/4
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip page 3/4 part no. la16b/y-s1
page 4/4 reference standard description test condition this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. part no. la16b/y-s1 test item operating life test reliability test: 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hous. low temperature storage test thermal shock test solder resistance test high temperature high humidity test 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) high temperature storage test the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. this test intended to see soldering well performed or not. solderability test 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 jis c 7021: b-12 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 ligitek electronics co.,ltd. property of ligitek only
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